Modelling Solder Joint Reliability of Bga Packages Subject to Drop Impact Loading Using Submodelling

With the trend towards miniaturization and multi-functionality in products such as mobile electronic devices, miniature IC packaging such as fine pitch Ball Grid Array (BGA) package and Chip Size Package (CSP) are increasingly being used. However, the inherent vulnerability of these miniature IC packagings has brought along new reliability problems. Among them, the drop/impact robustness is the most challenging in terms of testing and designing. The minute solder interconnections used to attach these packages to the printed wire board (PWB), in particular, are very vulnerable to drop impact loads, which mobile electronic equipment is reasonably expected to experience during usage.